Support structure and manufacture method thereof

ABSTRACT

A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.

CROSS-REFERENCE TO RELATED APPLICATIONS

Benefit is claimed to Taiwan Patent Application No. 105115094, filed May16, 2016; the contents of which are incorporated by reference herein intheir entirety.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a support structure and a manufacturemethod of the support structure, and more particularly, to a supportstructure located at the bottom of a ball grid array (BGA) and amanufacture method of the support structure.

2. Description of the Prior Art

Glue, such as Epoxy, is pouring to IC components or a substrate on a PCBassembly (PCBA) in a testing device before the bottom of a printedcircuit board (PCB) is stuffed with glue in the conventional technologyrelated to the field of fabrication of an integrated circuit (IC) and awafer testing device. Then, the PCBA is baked in an oven before the ICor the substrate is fixed on the baked PCBA. In this way, productshaving the IC and the wafer testing device have stronger resistance topressure and impact.

Conventionally, a standard operation is to feed the device glueartificially or dispense the device glue mechanically. That is, the ballgrid array (BGA) type components are packed with glue or dispensed withglue and baked with an oven or reflow to enhance the solidity of thestructure. However, the problem of the method is that it is hard todismantle and maintain the device after the device is completed.Besides, any damaged BGA type components are not replaceable; instead,the device needs to be scrapped entirely, which makes the productioncosts obviously high.

To stabilize the reliability of reworking and pressure impact when asubstrate or an interface plate is welded on the PCB and to improvereworkability of reflow welding, it is necessary to propose a supportstructure to improve resistance to pressure and impact and reworkingoperation after reflow.

SUMMARY OF THE INVENTION

An object of the present invention is to solve the problem that it ishard to dismantle and maintain the device after the device is fed withglue artificially or dispensed with glue mechanically in theconventional technology. Besides, any damaged BGA type components arenot replaceable; instead, the device needs to be scrapped entirely. Itshows that the production costs are obviously high.

According to the present invention, a support structure located at abottom of a ball grid array (BGA) is proposed. The support structureincludes a printed circuit board (PCB), a substrate, a support film, anda plurality of positioning components. The printed circuit board (PCB)includes a plurality of first positioning pin holes. The interface plateincludes a plurality of second positioning pin holes, corresponding tothe plurality of first positioning pin holes arranged on the PCB,respectively. The support film arranged on the PCB includes a pluralityof support portions. The plurality of positioning components penetratethe plurality of first positioning pin holes and the plurality of secondpositioning pin holes corresponding to the plurality of firstpositioning pin holes to assemble the support film on the PCB and theinterface plate.

According to another embodiment of the present invention, a plurality ofcopper columns are arranged below the interface plate, and a pluralityof pads are arranged on the PCB and correspond to locations of theplurality of copper columns.

According to another embodiment of the present invention, a solder pasteis coated on the pad to fix the plurality of copper columns. The supportportion is arranged between every two adjacent copper columns. Thelength of each of the plurality of copper columns is smaller than thelength of the support portion.

According to the present invention, a support structure located at abottom of a ball grid array (BGA) is proposed. The support structureincludes a printed circuit board (PCB), a substrate, a support film, anda plurality of positioning components. The printed circuit board (PCB)includes a plurality of first positioning pin holes. The substrateincludes a plurality of second positioning pin holes and correspondingto the plurality of first positioning pin holes arranged on the PCB,respectively. The support film is arranged on the PCB includes aplurality of support portions. The plurality of positioning componentspenetrate the first positioning pin hole and the second positioning pinhole corresponding to the first positioning pin hole to assemble thesupport film on the PCB and the interface plate.

According to another embodiment of the present invention, a plurality ofcopper columns are arranged below the substrate, and a plurality of padsare arranged on the PCB and correspond to locations of the plurality ofcopper columns.

According to another embodiment of the present invention, a solder pasteis coated on the pad to fix the plurality of copper columns; the supportportion is arranged between every two adjacent copper columns; thelength of each of the plurality of copper columns is shorter than thelength of the support portion.

According to the present invention, a method of manufacturing a supportstructure, located at a bottom of a ball grid array (BGA) includes stepsof: fabricating a plurality of first positioning pin holes on a printedcircuit board (PCB); arranging a plurality of second positioning pinholes on an interface plate, and corresponding the plurality of secondpositioning pin holes to the plurality of first positioning pin holesarranged on the PCB, respectively; arranging a support film on the PCB,and comprising a plurality of support portions; and assembling thesupport film on the PCB and a positioning component of the interfaceplate by penetrating the first positioning pin hole and a positioningcomponent of the second positioning pin hole corresponding to the firstpositioning pin hole.

According to another embodiment of the present invention, a plurality ofcopper columns are arranged below the interface plate at the bottom ofthe BGA, and a plurality of pads are arranged on the PCB and correspondto locations of the plurality of copper columns.

According to another embodiment of the present invention, a solder pasteis coated on the pad to fix the plurality of copper columns; the supportportion is arranged between every two adjacent copper columns; thelength of each of the plurality of copper columns is smaller than thelength of the support portion.

According to the present invention, a method of manufacturing a supportstructure, located at a bottom of a ball grid array (BGA) includes stepsof: fabricating a plurality of first positioning pin holes on a printedcircuit board (PCB); arranging a plurality of second positioning pinholes on a substrate, and corresponding the plurality of secondpositioning pin holes to the plurality of first positioning pin holesarranged on the PCB, respectively; arranging a support film on the PCB,and comprising a plurality of support portions; and assembling thesupport film on the PCB and a positioning component of the substrate bypenetrating the first positioning pin hole and a positioning componentof the second positioning pin hole corresponding to the firstpositioning pin hole.

According to another embodiment of the present invention, a plurality ofcopper columns are arranged below the substrate, and a plurality of padsare arranged on the PCB and correspond to locations of the plurality ofcopper columns.

According to another embodiment of the present invention, a solder pasteis coated on the pad to fix the plurality of copper columns. The supportportion is arranged between every two adjacent copper columns. Thelength of each of the plurality of copper columns is smaller than thelength of the support portion.

In contrast to related art, pin holes are additionally arranged onopposite positions of a substrate or an interface plate and a PCB torealize pin insertion fix and to improve the condition of pressureimpact produced during the testing process or rework replacement duringthe testing process in the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of the support structure according to thefirst embodiment of the present invention.

FIG. 2 is a sectional view of the assembled support structure as shownin FIG. 1.

FIG. 3 is a flow chart of a method of manufacturing a support structureaccording to the second embodiment of the present invention.

FIG. 4 is a flow chart of a method of manufacturing a support structureaccording to the third embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

These and other objectives of the claimed invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

A support structure is disclosed by a first preferred embodiment of thepresent invention. The support structure is arranged on the bottom of aball grid array (BGA). Please refer to FIG. 1 and FIG. 2. FIG. 1 is aschematic diagram of the support structure according to the firstembodiment of the present invention. FIG. 2 is a sectional view of theassembled support structure as shown in FIG. 1. To protect the supportstructure from being affected by the pressure or the impact generatedduring the testing process or to facilitate reworking replacement duringproduction, the support structure is arranged between a substrate or aninterface plate 12 and a printed circuit board assembly (PCBA) in anassembled testing device, and a bottom support is added in the supportstructure. To realize the method of support with the bottom, positioningpin holes need to be arranged opposite between the substrate or theinterface plate 12 and the PCB 10. In other words, the PCB 10 comprisesa plurality of first positioning holes 11, and the interface plate 12comprises a plurality of second positioning holes 11′ corresponding tothe plurality of first positioning holes 11, respectively. In this way,the pins can fix the device firmly. A layer of the support film 13 isarranged on the bottom of the support. The support film 13 is arrangedon the PCB 10. The support film 13 comprises a plurality of supportportions 13′. The support film 13, the PCB 10, and the interface plate12 are positioned using positioning components 18 penetrating theplurality of first positioning holes 11 and the plurality of secondpositioning holes 11′, which correspond to the plurality of firstpositioning holes 11.

Preferably, a plurality of copper columns 15 are arranged below theinterface plate 12. A plurality of pads 17 are arranged on the PCB 10,and the locations of the plurality of pads 17 correspond to thelocations of the plurality of copper columns 15. The support portion 13′is arranged between every two adjacent copper columns 15.

Preferably, a pad 17 is arranged on a welding spot 14. A solder paste 16is coated on the pad 17 to fix a copper column 15. The support portion13′ is arranged between every two adjacent copper columns 15. The lengthL of each of the plurality of copper columns 15 is smaller than thelength L′ of the support portion 13′ so that the plurality of coppercolumns 15 cannot contact the pad 17. In this way, the length L of theplurality of copper columns 15 on the pad 17 is roughly the same ratherthan being different because of possible errors, so the difficulty ofreworking does not increase. Besides, the length L′ of the supportportion 13′ is larger than the length of each of the plurality of coppercolumns 15. Even if the length of each of the plurality of coppercolumns 15 is different, the assembly is not affected. Also, the supportportion 13′ fills the space in the present invention, which replaces thesolder-filled area designed in the conventional technology. Therefore,the support film 13 for adhesion can be peeled off during the process ofreworking, which is good for dismantling the device effortlessly. Inthis way, it is more convenient to operate reworking.

Another support structure is proposed by the present invention.Differing from the support structure proposed by the embodiments asshown in FIG. 1 and FIG. 2, a substrate is substituted for the interfaceplate in the support structure proposed by the first embodiment of thepresent invention.

A manufacture method of a support structure is disclosed by a secondpreferred embodiment of the present invention, as shown in FIG. 3. FIG.3 is a flow chart of a method of manufacturing a support structureaccording to the second embodiment of the present invention. This methodcomprises the following steps.

Step S300: Fabricate a plurality of first positioning pin holes on aprinted circuit board (PCB).

Step S301: Arrange a plurality of second positioning pin holes on aninterface plate.

Step S302: Arrange a support film on the PCB.

Step S303: Combine the support film on the PCB and a positioningcomponent of the interface plate by penetrating the first positioningpin hole and a positioning component of the second positioning pin holecorresponding to the first positioning pin hole.

The plurality of second positioning pin holes correspond to theplurality of first positioning pin holes respectively in Step S301. Thesupport film comprises a plurality of support portions in Step S302. Aplurality of copper columns are arranged below the interface plate. Aplurality of pads are arranged on the PCB and the locations of theplurality of pads correspond to the locations of the plurality of coppercolumns A solder paste is coated on the pad to fix the copper column.The support portion is arranged between every two adjacent coppercolumns. The length of each of the plurality of copper columns issmaller than the length of the support portion so that the plurality ofcopper columns cannot contact the pad. In this way, the goal ofreworking is achieved.

A manufacture method of a support structure is disclosed by a thirdpreferred embodiment of the present invention, as shown in FIG. 4. FIG.4 is a flow chart of a method of manufacturing a support structureaccording to the third embodiment of the present invention. This methodcomprises the following steps.

Step S400: Fabricate a plurality of first positioning pin holes on aprinted circuit board (PCB).

Step S401: Arrange a plurality of second positioning pin holes on asubstrate.

Step S402: Arrange a support film on the PCB.

Step S403: Combine the support film on the PCB and a positioningcomponent of the substrate by penetrating the first positioning pin holeand a positioning component of the second positioning pin holecorresponding to the first positioning pin hole.

The plurality of second positioning pin holes correspond to theplurality of first positioning pin holes respectively in Step S401. Thesupport film comprises a plurality of support portions in Step S402. Aplurality of copper columns are arranged below the substrate. Aplurality of pads are arranged on the PCB and the locations of theplurality of pads correspond to the locations of the plurality of coppercolumns A solder paste is coated on the pad to fix the copper column.The support portion is arranged between every two adjacent coppercolumns. The length of each of the plurality of copper columns isshorter than that of the support portion so that the plurality of coppercolumns cannot contact the pad. In this way, the goal of reworking isachieved.

In the embodiments, the first positioning pin hole and the secondpositioning pin hole may be diagonal two, three, or four holes. However,the volume of the pin holes is not limited by the present invention.

In the present invention, pin holes are additionally arranged on theopposite positions of the substrate or the interface plate and the PCBto realize pin insertion fix and to improve the condition of pressureimpact produced during the testing process or rework replacement duringthe testing process.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device may be made while retainingthe teachings of the invention. Accordingly, the above disclosure shouldbe construed as limited only by the metes and bounds of the appendedclaims.

1. A support structure, located at a bottom of a ball grid array (BGA),comprising: a printed circuit board (PCB), comprising a plurality offirst positioning pin holes; an interface plate, comprising a pluralityof second positioning pin holes, corresponding to the plurality of firstpositioning pin holes arranged on the PCB, respectively; a support film,arranged on the PCB and comprising a plurality of support portions; anda plurality of positioning components, penetrating the plurality offirst positioning pin holes and the plurality of second positioning pinholes corresponding to the plurality of first positioning pin holes toassemble the support film on the PCB and the interface plate.
 2. Thesupport structure of claim 1, wherein a plurality of copper columns arearranged below the interface plate, and a plurality of pads are arrangedon the PCB and correspond to locations of the plurality of coppercolumns.
 3. The support structure of claim 2, wherein a solder paste iscoated on the pad to fix the plurality of copper columns; the supportportion is arranged between every two adjacent copper columns; thelength of each of the plurality of copper columns is smaller than thelength of the support portion.
 4. A support structure, located at abottom of a ball grid array (BGA), comprising: a printed circuit board(PCB), comprising a plurality of first positioning pin holes; asubstrate, comprising a plurality of second positioning pin holes andcorresponding to the plurality of first positioning pin holes arrangedon the PCB, respectively; a support film, arranged on the PCB andcomprising a plurality of support portions; and a plurality ofpositioning components, penetrating the first positioning pin hole andthe second positioning pin hole corresponding to the first positioningpin hole to assemble the support film on the PCB and the interfaceplate.
 5. The support structure of claim 4, wherein a plurality ofcopper columns are arranged below the substrate, and a plurality of padsare arranged on the PCB and correspond to locations of the plurality ofcopper columns.
 6. The support structure of claim 5, wherein a solderpaste is coated on the pad to fix the plurality of copper columns; thesupport portion is arranged between every two adjacent copper columns;the length of each of the plurality of copper columns is shorter thanthe length of the support portion.
 7. A method of manufacturing asupport structure, located at a bottom of a ball grid array (BGA),comprising steps of: fabricating a plurality of first positioning pinholes on a printed circuit board (PCB); arranging a plurality of secondpositioning pin holes on an interface plate, and corresponding theplurality of second positioning pin holes to the plurality of firstpositioning pin holes arranged on the PCB, respectively; arranging asupport film on the PCB, and comprising a plurality of support portions;and assembling the support film on the PCB and a positioning componentof the interface plate by penetrating the first positioning pin hole anda positioning component of the second positioning pin hole correspondingto the first positioning pin hole.
 8. The method of claim 7, wherein aplurality of copper columns are arranged below the interface plate atthe bottom of the BGA, and a plurality of pads are arranged on the PCBand correspond to locations of the plurality of copper columns.
 9. Themethod of claim 8, wherein a solder paste is coated on the pad to fixthe plurality of copper columns; the support portion is arranged betweenevery two adjacent copper columns; the length of each of the pluralityof copper columns is smaller than the length of the support portion. 10.A method of manufacturing a support structure, located at a bottom of aball grid array (BGA), comprising steps of: fabricating a plurality offirst positioning pin holes on a printed circuit board (PCB); arranginga plurality of second positioning pin holes on a substrate, andcorresponding the plurality of second positioning pin holes to theplurality of first positioning pin holes arranged on the PCB,respectively; arranging a support film on the PCB, and comprising aplurality of support portions; and assembling the support film on thePCB and a positioning component of the substrate by penetrating thefirst positioning pin hole and a positioning component of the secondpositioning pin hole corresponding to the first positioning pin hole.11. The method of claim 10, wherein a plurality of copper columns arearranged below the substrate, and a plurality of pads are arranged onthe PCB and correspond to locations of the plurality of copper columns.12. The method of claim 11, wherein a solder paste is coated on the padto fix the plurality of copper columns; the support portion is arrangedbetween every two adjacent copper columns; the length of each of theplurality of copper columns is smaller than the length of the supportportion.